The heart of the X-Headstage™ is a custom system-in-package (SiP) like chip package based on Intan RHD and RHS 2000 series IC. The multi-die and double sided IO architectures enable the X-Headstage™ to achieve minimal footprint by scaling across all 3 dimensions. KonteX's custom chip packs in more channel, more function per given area.