X-Headstage™ is a high fidelity bidirectional neural interface for delivering electrical stimuli and recording from large number of electrodes. The advanced headstage design results in volume reduction of more than 70% comparing to conventional designs. The size advantage significantly reduces stress, enhances the welfare of the animals, and improves experimental outcome.
The heart of the X-Headstage™ is a custom system-in-package (SiP) like chip package based on Intan RHD and RHS 2000 series IC. The multi-die and double sided IO architectures enable the X-Headstage™ to achieve minimal footprint by scaling across all 3 dimensions. KonteX's custom chip packs in more channel, more function per given area.
Every detail of X-Headstage™ is carefully considered and crafted to minimize size and maximize utility. Only the smallest components are sourced or they are custom made. A special module on module SMT manufacturing process is developed to fully take advantage of the 3D chip design.
X-Headstage™ can be optionally coated with a thin layer of Parylene-C, commonly used to protect implantable devices for chemical and moisture resistance. With the parylene coating and the tailor-made IP armor, the X-Headstage™ achives IP68 certification validated by a third party.
The X-Headstage’s ultra-compact footprint converts any passive implant into an active system — enhancing signal quality and enabling access to a broader range of brain regions.
Easily interface with any commercial electrode or design your own using our ready-to-use EIBs. We offer a comprehensive line of accessories to support efficient, cost-effective access to targeted brain regions.
KonteX’s engineering enables a 64-channel switchable stimulation and recording headstage — the smallest of its kind — to operate through a single cable.
The heart of the X-Headstage™ is a custom system-in-package (SiP) like chip package based on Intan RHD and RHS 2000 series IC. The multi-die and double sided IO architectures enable the X-Headstage™ to achieve minimal footprint by scaling across all 3 dimensions. KonteX’s custom chip packs in more channel, more function per given area.
X-Headstages support both commercial and lab-built electrodes.
EIB are readily available for purchase. Or, modify our reference EIB design to customize for your unique use.
Interface with commercial probes with common neural connectors is possible with our inclusive line of probe adapters.
Probes with direct mating interface is available from NeuroNexus Technologies.
At <5x10mm in relevent dimensions, it is possible to embed, or dental cement, the headstage with the electrodes as part of the implant. Having amplifying and digitizing electronics right by the electrode dramatically improves signal quality. Lower implant height minimizes mechanical stress, thus minimizes motion artifact. Reduced disturbance on sensitive neural interface from daily plug-in/out of headstage-electrode improves long term signal quality, longevity and stability.
