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One key advantage of an ultra-small headstage is the ability to embed or dental cement it along with the electrode to form an active implant. An active implant is a neural interface with integrated electronic circuitry for amplification, filtering, multiplexing, and more. These implants offer superior noise rejection against motion artifacts and produce cleaner signals with a lower noise floor.

Commercial probe manufacturers like NeuroNexus Technologies and Diagnostic BioChips have started offering probes with integrated Intan chips. While these electrodes provide excellent performance, they are generally more expensive, especially given their disposable nature.

The X-Headstage™ offers a more cost-effective alternative compared to commercial probes in the long run. Designed and validated for reuse, the X-Headstage™ provides a durable solution.

In addition to cost benefits, the X-Headstage™ with the electrode installed is even smaller than current active silicon probes. It features a SiP (system in package) chip design that allows for more efficient integration of components. Silicon probes can be easily adapted to work with the X-Headstage™ by replacing the probe board with smaller, more affordable connectors that mate with the X-Headstage™.

The X-Headstage™ also enables researchers to convert their passive implants into active designs. With KonteX’s ecosystem of connectivity accessories, the X-Headstage™ solution allows for flexible implant configurations, such as accessing multiple implants in different regions through a single cable solution.

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